Developed by Panacol, Structalit®5801 is a new 2-component adhesive system that demonstrates exceptional chemical and moisture resistance after accelerated aging. This resistance makes Structalit®5801是需要最高环境保护水平的电子组件结构键合和盆栽的理想材料。
结构®5801 is applied as potting to protect printed circuit boards in enclosures. Image Credit: Panacol-Elosol GmbH
结构®5801是一个黑色的2组分环氧粘合剂系统，具有简单的2：1混合比。固化在室温下在12小时内进行。为了更快的加工，该粘合剂也可以在80°C的中等温度下在30分钟内进行热固化。较低的温度固化可最大程度地减少组件的热应力，而较短的周期时间可提高生产率。这种中型粘度粘合剂混合物对包括铝和不锈钢在内的金属具有出色的附着力。它非常适合金属框架和外壳的结构粘合。结构®5801 also exhibits very good adhesion to plastics, such as PA6 GF or PBT. This multi-substrate adhesion allows Structalit®5801 to be used for many material combinations typically found in the consumer and automotive electronics industries.
This newly developed adhesive cures with low shrinkage, and exhibits good vibration and shock resistance due to its high bond strength and unitizing properties. During aging tests at temperatures above 130 °C, Structalit®5801实际上获得了纽带强度。在衰老期间，粘合剂暴露于传输油，生物柴油和酒精会导致粘结强度损失最小。这主要是由于该粘合剂的高度交联和低水分吸收。
结构®5801 can be dispensed from a 50 ml dual-chamber cartridge which is ideal for manual, short-run, or semi-automated production. This epoxy system is also available in sedimentation-stable bulk containers which can be used with meter-mix equipment for high volume production.
来源：https://www.panacol.com/