领先的合同电子制造商Kodiak Assembly Solutions LP很高兴宣布其进入01005 Ultra-Crocact套件组件。
Although already standard in smartphone assemblies, these ultra-compact devices have made their way into mainstream designs across many markets. Always a company driven by technological advancements and staying ahead of the curve, Kodiak jumped at the chance to experiment and qualify the assembly of 01005 component packages.
01005包装组件的成功资格至关重要的领域包括：
- Optimal PCB footprint layout
- Precise stencil aperture design and fabrication
- Paste printing setup and repeatability
- High machine placement accuracy
- SMT tape and feeder
- Reflow profile development
- Reflow atmosphere considerations (oxygen vs. nitrogen)
电感器，电容器和电阻都具有略有不同的终端和高度，需要考虑无缺陷组件。每种设计都提供不同的挑战，但是凭借Kodiak的经验，可以开发出强大的组装这些超压缩软件包的过程。
Kodiak Assembly looks forward to successfully applying this newest capability to its customers’ complex designs, and remains dedicated to the challenge of staying at the leading edge of placement technology to provide the highest quality assemblies across all markets.
Kodiak has extensive experience in a number of key electronic markets, including: IoT- Internet of Things, communications, LED lighting, medical and biotechnology, oil and gas, industrial controls, radio frequency (RF) solutions, security, and microprocessor embedded computer assemblies.
来源：www.kodiakassembly.com