Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of electronic devices subjected to thermo-mechanical stresses.

This compound combines a low CTE of 13-16x10^-6in/in/°C with a high glass transition temperature (T_g）140-150°C。它的导热率为11-12 BTU•in/ft^²•hr•°F [1.59-1.73 W/(m•K)]. It also exhibits low shrinkage upon curing, dimensional stability, and excellent structural strength. EP42HT-3AO is a reliable electrical insulator with a volume resistivity of >10¹⁴ohm-cm. This system is serviceable from -100°F to +400°F.

这种100％反应性环氧配方的重量为100至40个混合比，在75°F时进行100克批次后的工作寿命为60-90分钟。它在室温下有建议的治疗时间表过夜，然后在150-200°F时进行2-3小时。EP42HT-3AO可用于盎司，½品脱，品脱，夸脱和加仑套件容器。还提供了预混合和冷冻注射器的形式的专业包装选项。专业包装允许自动分配。A部分的颜色为白色，B部分是偏白。

Master Bond Epoxies for Potting Applications

Master Bond EP42HT-3AO is a two component epoxy system for bonding, potting and encapsulation applications, featuring a low coefficient of thermal expansion, high T_g, excellent chemical resistance and reliable electrical insulation properties. Read more about our formulations for potting applicationshereor contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:[电子邮件保护]。