Microporous copper foam coated with a thin, hard layer of copper oxide provides outstanding performance as a low-profile heat sink in passive cooling environments.
散热器的基础微孔铜泡沫结构的孔径在300至600微米之间,相对密度约为37%,比传统铜泡沫提供了更高的表面积。黑色铜氧化物覆盖了热导电泡沫的相互连接孔,可显着提高发射率,从而被动冷却性能。
Copper oxide coated foam provides a number of important benefits in the thermal management of electronic components:
- 散热器的高度可以降低,没有性能牺牲,或者
- Improved thermal performance can be achieved in the same physical envelope
- A smaller footprint is possible, since the size requirements of individual components can be reduced due to increased thermal efficiency
- The life of a component can be increased through a reduction in overheating
- Testing by the manufacturer has shown that these heat sinks can outperform their comparable competitors by up to 6 ˚C/W.
Goodfellowsupplies copper oxide coated foam in thicknesses of 4mm, 5mm, and 10mm.
Other sizes may be available upon request.
For more information about copper oxide coated foam, call 0800 731 4653 (UK) or +44 (0) 1480 424 800, or email[电子邮件保护]