SABIC创新塑料增加了EMI/RFI屏蔽化合物的能力

Sabic创新塑料today announced the expansion of its LNP* Faradex* family of specialty compounds to help electronics manufacturers achieve lighter-weight, thinner-wall housings with enhanced shielding capability. SABIC Innovative Plastics’ new LNP Faradex compounds can deliver better electromagnetic interference/radio frequency interference (EMI/RFI) shielding performance without increasing their loading of stainless steel fibers, thereby keeping costs and part weight down. Proprietary filler technology not only improves inherent shielding capability of existing loadings, but also increases modulus to enable strong and durable thin-wall parts. The addition of the new LNP Faradex compounds provides customers with an even broader range of EMI/RFI shielding performances and physical properties to help meet customer requirements.

五种新的LNP Faradex化合物是聚碳酸酯和丙烯腈丁二烯苯乙烯(PC/ABS)的合金。其中包括三个成绩,其中包括非2溴,非氯的阻燃剂(FR),以遵守诸如欧盟WEEE和ROHS指令以及其他ECO标签之类的环境法规。与以前的LNP FARADEX化合物相比,这两个非FR级别具有更高的抗冲击力。还可以根据客户需求获得其他基本树脂的品种。

“为了帮助我们的客户设计流线型,易于处理的电子设备,可以将更多功能挤入同一空间,我们创建了专有技术,实际上可以提高屏蔽性能,而无需任何其他不锈钢纤维,并将模量提高了三分之一以上Sabic Innovative Plastics LNP产品经理Eric Jiang说。“新的LNP Faradex化合物为制造商提供了竞争优势。与典型的模制聚合物产品相比,这些FARADEX化合物提供了EMI/RFI屏蔽性能,而无需昂贵的次要操作,因此可以减少总周期时间和总系统成本。与用于EMI/RFI屏蔽的传统金属相比,新的LNP FARADEX化合物不仅提供设计灵活性,而且还提供减轻体重,同时保持所需的EMI/RFI屏蔽性能。我们希望这些产品在汽车应用以及电子设备和电信应用的外壳中被广泛采用。”

新的Faradex化合物的火焰标志性等级的应用包括几乎所有中小型电子设备(例如服务器,便携式仪表和投影仪)的外壳。非绩效等级是数码相机外壳和车辆音频系统的绝佳候选者。

The new LNP Faradex compounds provide mechanical properties, part weight, and design freedom similar to those of standard unfilled base resins. Because their inherent shielding technology eliminates costly secondary steps such as applying a metallized layer to plastic components, manufacturers can potentially reduce total system costs. EMI/RFI attenuation permeates the part, ensuring consistent performance even in the case of surface scratches. Further, the ability to injection-mold new Faradex compounds enables intricate part design.

New LNP Faradex specialty compounds will be available in China in December 2007.

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