The Ionfab 300 IBE from Oxford Instruments is an ion-beam etch system that provides ultimate flexibility, along with excellent uniformity. The system is suited for an extensive range of applications.
The etch systems include versatile hardware options, such as single-substrate load lock, open load, and cassette to cassette. System specifications are in close conformance with the applications, thereby ensuring repeatable and quicker process results.
- Dual-beam configuration
- Multiple-mode functionality
- Unparalleled process reproducibility and batch uniformity
- Can be coupled with other plasma etch and deposition tools
- Cluster wafer handling or single-wafer load lock
- Very low surface film roughness
- Precise end-point detection for optical emission and SIMS
Features of Ionfab 300 IBE
- Patented high-speed substrate holder (up to 500 RPM) provided with a white light optical monitor design — highly accurate in-situ optical film control
- High throughput with minimized footprint — cost of operation is low
- High-quality thin film — very low contamination
- Flexible wafer-handling potential — single-wafer load lock, open-load, or cassette-to-cassette robotic handler
- Versatile configuration — sophisticated research applications
Image Credit: Oxford Instruments Plasma Technology
Image Credit: Oxford Instruments Plasma Technology