高级粘合剂，密封胶和涂料溶液

Master Bond’s advanced line of elastomeric adhesives set the standard for today’s high-performance systems. Elastomeric adhesives are unique for their remarkable toughness and elongation properties. They have great energy-absorbing characteristics and are the solutions of choice for applications requiring resistance to exposure to vibration, shock, and impact. They are additionally preferred for use in adhering mismatched substrates exhibiting varying coefficients of thermal expansion and contraction.

High Reliability and Performance

Master Bond's elastomeric systems are designed to offer superior reliability and long-term durability. They have earned a well-deserved reputation for excellent performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in applications ranging from design and production to repair, maintenance and field service.

好处

Some advantages of elastomeric adhesives are:

• 改善应力分布；应力均匀分布在整个粘结区域，从而最大程度地降低了高局部应力浓度。
• 粘合关节的出色疲劳性抗性，尤其是循环载荷。
• Superior resistance to mechanical shock and vibration even upon prolonged exposure to hostile environmental conditions.
• Superior thermal resistance.
• Availability of adhesive formulations for a wide range of service conditions from as high as 600°F to cryogenic environments.

主键聚合物系统EP30D-12

主键聚合物系统EP30D-12是一种用途广泛的两种组件弹性体，具有出色的强度，韧性和耐化学性，可用于高性能粘合，密封，铸造，盆栽和封装应用。它包含环氧树脂（例如强度，耐化学性和粘合剂质量）的公认优势性能特征，其聚氨酯的性能特性包括韧性，耐磨性和柔韧性。

Unique Properties of High-Performance Elastomer System EP30D-12

主键聚合物系统EP30D-12is formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 20 mix ratio on a weight basis. It is 100% reactive and does not contain any solvents or diluents. The EP30D-12 system cures with minimal shrinkage to a durable high strength and tough elastomer with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals, over the exceptionally wide temperature range of -60°F to more than +250°F.

主要应用

弹性系统的主要应用包括以下内容：

用于各种底物的键合和密封，这些基材表现出不同的热膨胀系数 冲击和振动阻力 General purpose thermal cycling Boroscopes and doublets Thermistors 各种垫圈应用 低模量，低应力密封 Attaching guide wires and catheter balloon bonding Protection of CSPs from mechanical shock and vibration 用于精选的航天器电子应用 In vacuum impregnation where rigid epoxy would be inappropriate For the bonding of delicate parts or parts where stress may be encountered 对许多金属，塑料，玻璃和橡胶底物的良好粘附。 用于敏感光学组件的粘结，密封和盆栽

For encapsulating intricate electrical and electronic components 用于封装热启动设备和模块 For bonding of stress sensitive devices. 压电和微置传感器 听起来很衰弱 To provide low stress on surface mount components For assembly of flexible circuits Solder replacement in select situations 组装加热元件 用于将散热器连接到电气组件 For the potting of transformers and inductors 粘结柔性基板和连接器 Encapsulating coils, potentiometers and modules 电缆接头/终止 Optoelectronic transceiver modules Bonding of semiconductor, capacitor, and resistor chips in micro and optoelectronic hybrid circuit fabrication To mold and cast cable connectors, harness assemblies, wiring, and other elastic components

Packaging

Master Bond Inc.提供多种不同的包装解决方案，以最佳满足特定的应用要求。它们旨在优化主键化合物的分配。Master Bond的创新包装解决方案将最大程度地提高生产率，降低浪费并保持一致的高产品可靠性。包装选项可用于环氧树脂，聚氨酯，多硫化物，有机硅，丙烯酸和紫外线疗法系统。此外，可用于厌氧，氰基丙烯酸酯，乳胶系统和其他树脂配方的特殊包装。

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