热管理对电子行业至关重要。较小，紧密包装的电路和组件会产生热量，最终影响众多电子设备的可靠性和寿命。有了进一步的小型化的期望，对缓解这些问题的化合物的需求至关重要。为了满足这些需求，主键一直处于开发具有卓越性能特性的热导电化合物的最前沿。
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Thermally Conductive Adhesives for High Vacuum Environments
Master Bond manufactures one and two component thermally conductive systems. They include epoxies, silicones and other elastomeric systems. Special formulations for unusual service conditions are available. They include serviceability to 500°F, at cryogenic temperatures, and in high vacuum environments as well as systems that are easily repairable. Designed for easy application, these compounds can be purchased in convenient packaging. They are used on heat sinks, fan sinks, package lids, motor controls, multiplexers, sensors, power semiconductors and thermistors. Toughened systems have been successfully employed in applications requiring resistance to shock, vibration and thermal cycling.
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主键导电胶产品
The following table summarizes Master Bond's range of thermal adhesives systems.
Product |
描述 |
EP30AN-1 |
High thermal conductivity potting & bonding epoxy that meets NASA low outgassing specifications. Cures rigid. |
EP37-3FLFAO |
用于盆栽和粘合。良好的导热率。治愈灵活。符合NASA低燃气认证。低温维修。 |
EP21TDCANHT |
General purpose, flexibilized epoxy with high thermal conductivity. Widely used for bonding dissimilar substrates. |
EP21TCHT-1 |
NASA low outgassing certified, high temperature resistant, thermally conductive epoxy. Cryogenically serviceable. |
SUPREME 10AOHT |
One part, no-mix, thermally conductive epoxy adhesive/sealant. Unlimited working life at room temperature. Oven cures at 250-300°F. Excellent physical properties. Exceptional performance. |
Typical Applications for Master Bond Thermal Conductive, Electrically Insulating Systems
Typical applications of Master Bond's range of adhesives, sealants, coatings products for thermal adhesives include:
- 盆栽模块
- Adhesive for power supply components
- 导航系统
- SECC format devices and microprocessors
- Potting/encapsulating sensors
- Pin sealing
- 卫星无线电接收器进行散热
- Electric heating systems
- Adhesive for ink jet printer heads
- Voltage regulators
- Barrier to environmental contamination
- Alarm systems
- Battery monitoring systems
- Control units
- 涉及半导体的附件
- Aerospace/NASA approved environments
- BGA-die heat spreader interface
- Bond flexible/rigid circuit boards
- SMD (surface mounted devices) attach
- Die attach hybrid/MCM (multi chip module)
- Noise filters
- Barrier to shock and vibration isolation
- Bonding high power LEDs to PCBs
- Screen printing for heat dissipation
- Speciality adhesives for uniform bondlines
- In-line bonding
- Stack chip bonding
- 密封过滤器介质到金属端盖
- Bonding integrated circuits to heat sinks
- Electric fuel injection systems
- Airbag controllers
- 连接器密封
- 仪表板系统
- 探测器
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- Ground plane bonding
- Antenna systems
- Wireless communications
- Satellite transmissions
- 底物附件
- Potting power supplies
- 盖子粘结
- Potting and cavity filling
- Cryogenic applications
- 冷却风扇控制器
- CSPs (chip-scale packages)
- 底板附着
- Rapid curing thermal systems for high volume assembly
- Mounting heat sinks and heat sensitive electronic components
- Wafer lamination (thin-slice semiconductor material)
- Power conversion-automated power semiconductor attachment
- Thermal bridge to fill gaps between heat sources and heat sinks of power components
- Dissipate heat around electrical components in various machine parts
- RF power applications (radio frequency amplifier converts a low-power radio-frequency signal into a larger signal of significant power)
- 用于包装材料的快速固化热系统，包括陶瓷，金属杂交包装，有机板和半导体材料亚博网站下载
- Selected and specialized RFID Tags (radio frequency identification tags)
- 变压器，传感器，线圈（例如窒息和电磁阀以及高振动线圈）和微电路的封装，盆栽和铸造
- Bonding components with mismatched coefficients of thermal expansion
- Staking transistors, diodes, resistors, integrated circuits and other thermal-sensitive components to printed circuit boards
- 与金属，二氧化硅，脂肪石，氧化铝，蓝宝石和其他陶瓷的键合粘合，玻璃，塑料
- Excellent resistance to weathering, water, salts, and many other organic and inorganic compounds, mild acids and alkalis, and many other chemicals including petroleumsolvents, lubricating oils, and alcohol
- Strong, durable electrically insulating/thermally conducting bonds producing good temperature and impact resistance
- Repair of electrical modules, printed circuits, wave guides, flat cables & high frequency shields
- Rectifiers (electrical device that converts alternating current to rectified direct current)
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High Performance Thermal Adhesives, Sealants and Coatings for the Electronic Industry
Master Bond's thermally conductive products are designed to offer superior quality and long-term durability. They have earned a well-deserved reputation for their performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in applications ranging from design and production to repair, maintenance and field service.
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Important Thermally Conductive System Performance Requirements
主邦德的热导电系统范围旨在满足特定的性能要求。最重要的是：
•耐化学性
• Cryogenically Serviceable
•易于修复
• Electrically Insulative
• Excellent Adhesion
• Dimensional Stability
• High Temperature Resistance
• Low Outgassing
•低收缩
• Low Stress
• Resistance to Water
• Low Thermal Expansion Coefficient |
• Thermal Conductivity
• Peel Strength
• Durability
• Thermal Cycling
•电击性
• Vibration Resistance
• Dielectric Strength
• Volume Resistivity
• Dielectric Constant
• Dielectric Factor
•硬度
• Tensile Strength
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New Thermal Conductive/Electrically Insulative Epoxy Systems
主键已开发出各种新的热导电和电绝缘环氧系统。他们包括：
| Product |
描述 |
| EP36AO |
Toughened epoxy with outstanding thermal shock resistance. Serviceable up to +500° F. Shore D hardness 35. High bond strength. One part B-stage compound. |
| EP30FLAO |
Low viscosity, two component epoxy formulation. Toughened and flexibilized. Resistant to thermal cycling. Superior physical strength properties. Dimensional stability. Cures at room temperature. |
| EP21ANHT |
一对一的混合比，两部分环氧系统。高温电导率异常高。可维修至 +400°F。在环境温度下固化。特殊的耐化学性。 |
| EP121AO |
优质电绝缘特性。两部分环氧配方。低粘度，室温固化环氧化合物。可维修至 +450°F至500°F。出色的长期耐用性和尺寸稳定性。出色的耐化学性。 |
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此信息已从Master Bond Inc.提供的材料中采购，审查和改编。亚博网站下载
有关此消息来源的更多信息，请访问主邦德公司。