钛和钛合金的扩散键和电子束扩散键合

Advantages of Diffusion Bonding

•Limited microstructural changes

•Can join dissimilar titanium alloys

•No filler required

•Can fabricate very complex shapes, especially using superplastic forming

扩散键合的缺点

•Slow

•High vacuum required

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Conventional Diffusion Bonding

Titanium is the easiest of al common engineering materials to join by diffusion bonding, due to its ability to dissolve its own oxide at bonding temperatures. Conventional diffusion boding is a slow process and requires careful control of temperature, and joint face alignment. The process also needs to be undertaken in a vacuum. Under ideal conditions a bond of very high quality can be made with no flash formation. However, the process is slow, and requires considerable precision, making it unattractive for field use, although it has been used in the aerospace industry, in particular with superplastic forming. The process, including superplastic forming, is also used in the successful development of titanium compact heat exchangers.

电子束扩散键合

该过程是扩散键合的一种变体，其中只有界面区域被加热，从而可节省大量能源。加热源是一种电子束，以这种速度扫过关节区域，以至于防止钛合金的融合。在整个关节上施加力。由于加热区域非常有限，因此可以使用较高的力，而无需焊接组件的塑性崩溃的风险，从而大大减少了焊接时间，通常是通过数量级的阶数。该过程已被调查，以加入自己和其他钛合金并加入钛合金合金的几种钛合金合金。从这些试验中报道了非常好的结果，但是迄今为止，该过程尚未商业使用。

Source: Titanium Information Group

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