Cameron Harker and Yohannes Desta, Ph.D., recently presented at the SWTest 2021 Conference. Their presentation – Challenges of Expanding Large Area Arrays for Fine Pitch Vertical Probe Cards – was awarded the Best Data Presentation of the Conference.
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Semiconductor manufacturers are on an unrelenting mission to bring down the total cost of testing at sort. A significant contributing factor to reducing the cost of tests is increasing simulations of the Device Under Test, which necessitates a subsequent increase in theprobe card active area。
FormFactor has worked on the development of new probe card architecture to tackle the complexities of fine pitch, high CCC and high temperature range for applications in wire bond probing.
One industry that is leading the uptake of this new probe card architecture is the automotive semiconductor market. It is anticipated that the automotive IC market will grow to about $40 billion in 2021, with a projected 16.8% CAGR between 2021 – 2025.
If the increased demand and chip shortage due to the impact of the pandemic is factored in, the timing for this new probe card architecture is excellent.
Challenges for automotive semiconductor tests that the new probe card architecture addresses include:
- 汽车供应商正在推动降低的成本保持竞争力
- Dense device circuitry under the pads
- 设备可以对CRE和CRES变化敏感
- 垫俯仰继续缩小
- 垫子尺寸正在减小以支撑模具尺寸收缩
- 结构通常是用于电线键应用的外围垫
- 极端测试温度继续升高
To ensure these challenges are met, and to enhance the probe card active area,FormFactor designed新的探测卡体系结构 - 大区域阵列（LAA）。有关这种新体系结构及其如何满足汽车IC市场需求不断增长的信息的更多信息，download the presentation here(PDF).
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